- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 1/03 - Use of materials for the substrate
Patent holdings for IPC class H05K 1/03
Total number of patents in this class: 7294
10-year publication summary
686
|
676
|
685
|
715
|
706
|
688
|
654
|
668
|
598
|
187
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Murata Manufacturing Co., Ltd. | 22355 |
282 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
245 |
Mitsubishi Gas Chemical Company, Inc. | 3188 |
209 |
Kyocera Corporation | 12735 |
119 |
DIC Corporation | 3597 |
118 |
Resonac Corporation | 2233 |
101 |
LG Innotek Co., Ltd. | 6758 |
100 |
Shengyi Technology Co., Ltd. | 255 |
97 |
Hitachi Chemical Company, Ltd. | 2455 |
92 |
Denka Company Limited | 2189 |
89 |
Ibiden Co., Ltd. | 1724 |
88 |
Agc, Inc. | 4029 |
80 |
Nitto Denko Corporation | 7879 |
77 |
International Business Machines Corporation | 60644 |
74 |
Kaneka Corporation | 4445 |
74 |
FUJIFILM Corporation | 27102 |
67 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
67 |
Apple Inc. | 50209 |
65 |
Intel Corporation | 45621 |
63 |
Sumitomo Electric Industries, Ltd. | 14131 |
60 |
Other owners | 5127 |